Thermoplastic interconnect for electronic device and method for

Details Thermoplastic interconnect for electronic device and method for Thermoplastic interconnect for electronic device and method for

1995-05-05

1996-12-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361769, 361771, 361779, 257738, 22818021, H05K 710

Patent

active

055837476

ABSTRACT:
Conductive thermoplastic interconnects (120) for electronic devices are disclosed. The interconnects may take the form of bumps or spheres, and may be used in applications where metal bumps are conventionally used. Bumps (310) may be attached by retaining them in a vacuum fixture (312) and momentarily contacting them with the substrate (316) requiring the bumps (310). The substrate (316) has been heated sufficiently to cause wetting of the conductive thermoplastic bump (310).

REFERENCES:
patent: 5235741 (1993-08-01), Mase
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5262351 (1993-11-01), Bureau et al.
W. C. Ward, "Pressure Contact Type Chip Join Technique," IBM Technical Disclosure Bulletin, vol. 18, No. 9, Feb. 1976, p. 2817.

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