Stock material or miscellaneous articles – Hollow or container type article – Shrinkable or shrunk
Patent
1991-04-17
1992-09-01
Seidleck, James J.
Stock material or miscellaneous articles
Hollow or container type article
Shrinkable or shrunk
428 349, 174 84R, 174DIG8, 525199, C08L 2716, H01R 472
Patent
active
051437619
ABSTRACT:
A thermoplastic fluoropolymer adhesive composition containing a thermoplastic fluoropolymer, an elastomeric fluoropolymer, a thermoplastic ethylene copolymer and a tackifier, in which the combined amount of ethylene copolymer and tackifier is less than about 30% by weight (based on the weight of the four components) and the ratio of ethylene copolymer is less than about 2:1, has improved sealing performance and flame resistance than similar compositions containing greater amounts of ethylene copolymer and tackifier. The composition is particularly useful for sealing surfaces of uncrosslinked ethylene-tetrafluoroethylene copolymers.
REFERENCES:
patent: 3243211 (1966-03-01), Wetmore
patent: 3525799 (1970-08-01), Ellis
patent: 4197380 (1980-04-01), Chao et al.
patent: 4282396 (1981-08-01), Watine et al.
patent: 4283596 (1981-08-01), Vidakovits et al.
patent: 4387168 (1983-06-01), Morita
patent: 4504699 (1985-03-01), Dones et al.
patent: 4696841 (1987-09-01), Vidakovits
patent: 4722471 (1988-02-01), Gray et al.
patent: 4832248 (1989-05-01), Soni
patent: 5008340 (1991-04-01), Guerra
International Search Report for PCT/US89/05763.
International Search Report for PCT/US89/05761.
Chiotis Achilles
Soni Pravin
Burkard Herbert G.
Buttner David
Gerstner Marguerite E.
Raychem Corporation
Seidleck James J.
LandOfFree
Thermoplastic fluoropolymer adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermoplastic fluoropolymer adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoplastic fluoropolymer adhesive composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-766719