Thermoplastic article having high-relief surface

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Physical dimension specified

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428332, 428354, 523171, 528272, 528302, 528307, 528308, B32B 2718

Patent

active

060250690

ABSTRACT:
Disclosed is a novel thermoplastic article having a high-relief, molded or embossed surface produced by contacting a laminate comprising a first or outer copolyester sheet material and a second or backing copolyester sheet material with heat and pressure using a heated element which simultaneously causes the material to be bonded and a high-relief, decorative appearance to be produced on at least one surface of the thermoplastic article. Also disclosed is an embossed or molded, bonded laminate comprising, in order, (1) a first or outer copolyester layer, (2) a second layer comprising a film which is colored or which bears an image or pattern, and (3) a third or backing copolyester layer, wherein the first and third layers are composed on the above-described copolyester. The copolyesters of the thermoplastic articles and laminates are selected from copolyesters having an inherent viscosity of 0.5 to 1.2 dL/g, when measured at 25.degree. C. using 0.50 grams of polymer per 100 mL of a solvent consisting of 60 weight percent phenol and 40 weight percent tetrachloroethane, comprising (i) diacid residues comprising at least 80 mole percent terephthalic acid residues; and (ii) diol residues comprising from 98 to 1 mole percent ethylene glycol residues and from 2 to 99 mole percent residues derived from 1,3- or, preferably, 1,4-cyclohexanedimethanol in which the ethylene glycol and cyclohexanedimethanol residues constitute at least 80 mole percent of the diol residues.

REFERENCES:
patent: 5643666 (1997-07-01), Eckart et al.
Patent Abstracts of Japan, vol. 097, No. 006, Jun. 30, 1997 & JP 09 052338 A (Kanebo Ltd.), Feb. 25, 1997. See abstract.
U. S. Application Serial No. 09/096,969 Filed Jun. 12, 1998, Entitled "Thermoplastic Article Having Textile Fiber Fabric Embedded Therein" by Michael Dennis Eckart and Raymond Lynn Goodson.
U. S. Application Serial No. 09/096/970 Filed Jun. 12, 1998, Entitled "Thermoplastic Article Having Metallic Wire, Rod or Bar Embedded Therein" by Michael Dennis Eckart and Rayamond Lynn Goodson.

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