Thermoforming methods

Details Thermoforming methods Thermoforming methods

1985-09-16

1987-05-19

Woo, Jay H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156227, 156229, 156285, 156499, 264544, 264553, 264554, B32B 3100

Patent

active

046665447

ABSTRACT:
Thermoforming machines with a heating station and a downstream mold station have carrier clamp frames for gripping the edges of sheets of plastic at a load station and indexing them successively to a heating station and a mold station. The carrier frame members to which the plastic may be releasably clamped carry their own remotely operated clamps and are themselves expandable and contractible to a condition in which, prior to molding, they control the sag in the sheet formed during heating of the sheets to differential pressure forming temperature. The plastic sheet can be molded to only a portion of a product which functions as a mold member.

REFERENCES:
patent: 1895309 (1933-01-01), Boomershine
patent: 2912716 (1959-11-01), Frownfelter et al.
patent: 2918696 (1959-12-01), Bottoms et al.
patent: 3025566 (1962-03-01), Kostur
patent: 3176349 (1965-04-01), Meisner et al.
patent: 3466706 (1969-09-01), Asano
patent: 3600746 (1971-08-01), Kostur et al.
patent: 3664791 (1972-05-01), Brown
patent: 3779687 (1973-12-01), Alesi
patent: 3810731 (1974-05-01), Anderson
patent: 3868209 (1975-02-01), Howell
patent: 3978905 (1976-09-01), de Lama et al.
patent: 4194938 (1980-03-01), Figge et al.
patent: 4239472 (1980-12-01), Atkinson et al.
patent: 4337116 (1982-06-01), Foster et al.
patent: 4406729 (1983-09-01), Elias
patent: 4430814 (1984-02-01), Wulc
patent: 4430815 (1984-02-01), Wulc
patent: 4471543 (1984-09-01), Wolsey

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