Thermoforming apparatus for printed substrate

Plastic article or earthenware shaping or treating: apparatus – Preform reshaping or resizing means: or vulcanizing means... – Including shaping means comprising fluid pressure contacting...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2642978, 264551, 264554, 425397, 425DIG48, B29C 5110

Patent

active

061026867

ABSTRACT:
A thermoforming method and apparatus is provided for a flat thin sheet plastic substrate having printed material thereon in the form of a matrix of a plurality of items. The substrate is clamped between a pair of clamp plates providing support for the substrate around the perimeter thereof and also in a matrix support pattern having a plurality of subperimeters providing individual support around the respective perimeter of each item. The assembly is heated, and then thermoformed into a contoured three dimensional workpiece by pushing a matrix of a plurality of tool faces into the substrate at respective items. The matrix support pattern of the clamp plates along the plurality of subperimeters prevents sagging across the substrate during heating, and isolates the items from each other during deformation of the substrate by the tool faces.

REFERENCES:
patent: 2962764 (1960-12-01), Trojanowski et al.
patent: 3253069 (1966-05-01), Holley et al.
patent: 3461504 (1969-08-01), Becker et al.
patent: 3483284 (1969-12-01), Shelby
patent: 3600753 (1971-08-01), Otto
patent: 5230910 (1993-07-01), Eggert
patent: 5618486 (1997-04-01), Yoshimi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermoforming apparatus for printed substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoforming apparatus for printed substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoforming apparatus for printed substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2000468

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.