Thermoelectrically cooling electronic devices

Details Thermoelectrically cooling electronic devices Thermoelectrically cooling electronic devices

2004-03-19

2010-11-16

Jones, Melvin (Department: 3744)

Refrigeration

Using electrical or magnetic effect

Thermoelectric; e.g., peltier effect

C062S003200

Reexamination Certificate

active

07832215

ABSTRACT:
A heat sink may be clamped to a thermoelectric cooler and vapor chamber using a U-shaped retention band. The band may attach underneath the vapor chamber, extending around the thermoelectric cooler, and over a heat sink. The heat sink may include a plate to distribute the force of the band across the heat sink. Bolts may be utilized to transfer the force from the free ends of the U-shaped retention band to a vapor chamber support frame. Thus, in some embodiments of the present invention, a thermoelectric cooler may be clamped to a heat sink without wasting heat transfer area through the use of bolts, without unnecessary bending, and without requiring a relatively thick base on the heat sink.

REFERENCES:
patent: 4622822 (1986-11-01), Beitner
patent: 5355678 (1994-10-01), Beitner
patent: 5670914 (1997-09-01), Liberman et al.
patent: 6062911 (2000-05-01), Davis et al.
patent: 6532746 (2003-03-01), Bloom et al.
patent: 6543246 (2003-04-01), Wayburn et al.

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