Thermoelectric module having reduced spacing between semiconduct

Details Thermoelectric module having reduced spacing between semiconduct Thermoelectric module having reduced spacing between semiconduct

1993-10-22

1995-07-18

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

136203, 257930, 361719, 437903, H05K 720

Patent

active

054347440

ABSTRACT:
A method of manufacturing a thermoelectric module is provided. A first electrically conductive pattern is defined on a first substrate and a second electrically conductive pattern is defined on a second substrate. Alternating bars of a first thermoelectric material and a second thermoelectric material are arranged parallel to each other. The bars are fixed into place on the first conductive pattern by an effective thermal and electrical connection with the conductive pattern. One such connection means is soldering. Then the bars are separated into elements. The second substrate is positioned over the elements and fixed to the elements to complete the manufacture of the TEM.

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patent: 4855810 (1989-08-01), Gelb
patent: 4902648 (1990-02-01), Ohta
patent: 5168339 (1992-12-01), Yokotani
patent: 5228923 (1993-07-01), Hed
patent: 5241828 (1993-09-01), Kapitulnik

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