Thermoelectric module

Details Thermoelectric module Thermoelectric module

2007-11-27

2007-11-27

Jones, Melvin (Department: 3744)

Refrigeration

Using electrical or magnetic effect

Thermoelectric; e.g., peltier effect

C062S003700

Reexamination Certificate

active

10874525

ABSTRACT:
A thermoelectric module having areas of highly thermally conductive material integrated into a substrate layer. For one embodiment copper pads are integrated into the external surface of the substrate of the hot side of the thermoelectric module. The copper pads allow direct connection of a heat removal device to the thermoelectric module thereby reducing thermal resistance. Thermal vias may be formed through the substrate to further reduce thermal resistance.

REFERENCES:
patent: 5712448 (1998-01-01), Vandersande et al.
patent: 5724818 (1998-03-01), Iwata et al.
patent: 6262357 (2001-07-01), Johnson et al.
patent: 6278049 (2001-08-01), Johnson et al.
patent: 6347521 (2002-02-01), Kadotani et al.
patent: 6385976 (2002-05-01), Yamamura et al.
patent: 6387565 (2002-05-01), Aihara et al.
patent: 6410971 (2002-06-01), Otey
patent: 6424533 (2002-07-01), Chu et al.
patent: 6637210 (2003-10-01), Bell
patent: 6653557 (2003-11-01), Wolf et al.
patent: 6679064 (2004-01-01), Chang et al.
patent: WO 02/25698 (2002-03-01), None
patent: WO 2005/111715 (2005-11-01), None

Affiliated with

Also associated with

Rating

Thermoelectric module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoelectric module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoelectric module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3889371