Thermoelectric cooling of magnetic head assemblies

Dynamic magnetic information storage or retrieval – Head – Head accessory

Patent

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Details

360110, 360128, 62 3, F25B 2102, G11B 510, G11B 540

Patent

active

044059612

ABSTRACT:
The temperature of a magnetic head assembly is reduced by active heat transfer accomplished by a thermoelectric cooling element positioned between and in contact with the head assembly housing and the head assembly. The housing serves as a heat sink from which thermal energy is diffused.

REFERENCES:
patent: 3319238 (1967-05-01), Jacoby
patent: 4230907 (1980-10-01), Hasselbach et al.
IBM Technical Disclosure Bulletin, vol. 23, No. 4, 9-80, p. 1659.

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