Thermoelectric cooling for microelectronic packages and dice

Details Thermoelectric cooling for microelectronic packages and dice Thermoelectric cooling for microelectronic packages and dice

2006-01-03

2006-01-03

Jones, Melvin (Department: 3744)

Refrigeration

Using electrical or magnetic effect

Thermoelectric; e.g., peltier effect

C062S003700, C062S259200

Reexamination Certificate

active

06981380

ABSTRACT:
Apparatus and methods in accordance with the present invention utilize thermoelectric cooling (TEC) technology to provide enhanced power distribution and/or dissipation from a microelectronic die and/or microelectronic packages. Individual TEC devices are thermally interconnected with the microelectronic die in a number of placement configurations, including between the microelectronic die and the heat sink, on the integrated heat spreader (IHS) inner surface, and on the IHS outer surface. TEC devices comprise p- and n-type semiconducting material created using similar process as the microcircuits. The TEC devices are located in various regions within or on the microelectronic die, including directly below the microcircuits, on the backside of the microelectronic die, and on a separate substrate of microelectronic die material fabricated apart from the microelectronic die and subsequently thermally coupled to the backside of the microelectronic die.

REFERENCES:
patent: 3710251 (1973-01-01), Hagge et al.
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patent: 5627112 (1997-05-01), Tennant et al.
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patent: 6018616 (2000-01-01), Schaper
patent: 6055815 (2000-05-01), Peterson
patent: 6222113 (2001-04-01), Ghoshal
patent: 6243268 (2001-06-01), Kang et al.

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