Thermoelectric conversion module having channels filled with sem

Details Thermoelectric conversion module having channels filled with sem Thermoelectric conversion module having channels filled with sem

1996-11-07

1999-09-14

Abraham, Fetsum

Active solid-state devices (e.g., transistors, solid-state diode

Thermoelectric cooling

257120, 257374, 257275, 257712, 257713, 257717, 257467, 257470, 62 32, 62 33, 136224, 136225, H01L 2356

Patent

active

059527285

ABSTRACT:
A thermoelectric conversion module having a large capacity and a curved surface which can be secured to a corresponding curved surface of a base member is manufactured by inserting N type and P type semiconductor strips into through holes formed in a honeycomb structural body, filling spaces between walls defining the through holes and the semiconductor strips with an electrically insulating filler members made of an easily deformable material such as polyimide resin and silicone resin, cutting the honeycomb structural body into a plurality of thermoelectric conversion module main bodies each having a desired surface configuration, and providing metal electrodes on both surfaces of a thermoelectric conversion module main body such that alternate N type and P type semiconductor elements are connected in cascade.

REFERENCES:
patent: 2749716 (1956-06-01), Lindenblad
patent: 2980746 (1961-04-01), Claydon
patent: 3509620 (1970-05-01), Phillips
patent: 3615870 (1971-10-01), Crouthamel
patent: 3726100 (1973-04-01), Widakawich
patent: 4149025 (1979-04-01), Niculescu
patent: 4275259 (1981-06-01), Yamamoto et al.
patent: 4493939 (1985-01-01), Blaske et al.
patent: 5156004 (1992-10-01), Wu et al.
patent: 5430322 (1995-07-01), Koyanagi et al.

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