Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive
Reexamination Certificate
2011-01-06
2011-10-04
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Thermally responsive
C438S054000, C136S203000, C257S686000, C257S712000, C257S717000, C257S930000, C257SE23110
Reexamination Certificate
active
08030113
ABSTRACT:
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
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A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices, Howard Chen, Louis Hsu, and Xiaojin Wei. ISBN: 978-2-35500-002-7, Therminic 2007 pp. 1-6, Budapest, Hungary, Sep. 17-19, 2007.
Hsu Louis Lu-Chen
Wang Ping-Chuan
Wei Xiaojin
Zhu Huilong
Davis Jennifer R.
International Business Machines - Corporation
Joy Jeremy
Smith Zandra
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