Thermode structure having an elongated, thermally stable blade

Electric heating – Heating devices – Tool or instrument

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219 8516, 219221, 219228, 219243, 228 51, 2281802, H05B 300, B23K 302

Patent

active

052295753

ABSTRACT:
A thermode having a relatively long and thick blade composed of a high thermal conductivity, low thermal expansion material, e.g., molybdenum, provides an elongated contact surface for bonding a row of leads of an electronic component to a circuit board. A thermode holder is coupled to the blade by means of a plurality of struts, including a pair of outer struts, each connected at one end of the respective ends of the blade and at an acute angle facing the other outer strut, and a pair of shorter inner struts, each connected with the blade intermediate the ends of the blade and at an acute angle facing the outer strut adjacent thereof, such that in response to a force urging the blade against the circuit board, the outer struts cause a negative deflection of the blade with respect to the board and the inner struts decrease the magnitude of the deflection. The blade is heated by electric current supplied thereto from a transformer through the inner and outer struts. A step in the contact surface of the blade provides an acceptally narrow bonding footprint while allowing use of a desirably thermally massive thick blade.

REFERENCES:
patent: 1802079 (1931-04-01), Helle
patent: 2514618 (1950-07-01), Ancell
patent: 4871899 (1989-10-01), DuFrenne
patent: 4942282 (1990-07-01), Jensen
"Bonding Tip Temperature Control", Coombs et al, IBM Technical Disclosure Bulletin vol. 23, No. 10, Mar. 1981.
"Three-legged Solder Reflow Bonding Tip", Houser, IBM Technical Disclosure Bulletin vol. 22, No. 1, Jun. 1979.
Individually Controllable Wire Solder Reflow Bonding Tip, Baldwin et al, IBM Technical Disclosure Bulletin vol. 18, No. 12, May 1976.

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