Thermode design for tab and method of use

Metal fusion bonding – Process – Plural joints

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228 447, H01L 21603

Patent

active

047368829

ABSTRACT:
An improved thermode for bonding interconnect tape to at least one bonding site on an electronic device is disclosed. The thermode includes a component for controlling deflection of the interconnect tape at a position outside of said bonding site whereby thermal stresses generated in the interconnect tape while bonding are substantially reduced.

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patent: 4234666 (1980-11-01), Gursky
patent: 4331740 (1982-05-01), Burns

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