Thermocouple circuit and method and system for forming same

Details Thermocouple circuit and method and system for forming same Thermocouple circuit and method and system for forming same

2007-12-20

2010-11-09

Caputo, Lisa M (Department: 2855)

Thermal measuring and testing

Temperature measurement

By electrical or magnetic heat sensor

C374S007000

Reexamination Certificate

active

07828480

ABSTRACT:
Disclosed is a thermocouple circuit that exhibits reduced levels of thermocouple drift. The thermocouple is generally comprised of first and second thermoelectric elements formed of first and second thermoelectric materials, respectively. The first and second thermoelectric elements are coupled to an electrically conductive substrate through intermediate first and second tab elements, respectively. The first and second tab elements are preferably formed of the respective first and second thermoelectric materials, and coupled to the substrate in a spaced apart configuration such that the first and second tab elements, are not physically coupled one to the other. Also disclosed are systems and methods for the preparation and use of the thermocouple circuits disclosed herein.

REFERENCES:
patent: 6951419 (2005-10-01), Tsuchiya
patent: 2002/0088640 (2002-07-01), Schuh et al.
patent: 2004/0220775 (2004-11-01), Schuh
patent: 2004/0255998 (2004-12-01), Schuh
patent: 2005/0129091 (2005-06-01), Habboosh
patent: 2006/0227849 (2006-10-01), Phillips
patent: 2007/0200475 (2007-08-01), Schaffer
patent: 2009/0107537 (2009-04-01), Conti

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