Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating has specified thickness variation
Patent
1991-03-04
1993-09-07
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating has specified thickness variation
205122, 205123, 205170, 205209, C25D 502
Patent
active
052425690
ABSTRACT:
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.
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Kang Sung K.
Palmer Michael J.
Reiley Timothy C.
Topa Robert D.
International Business Machines - Corporation
Leader William T.
Morris Daniel P.
Niebling John
Riddles Alvin J.
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