Thermocompression bonding apparatus, thermocompression bonding m

Metal fusion bonding – Process – Plural joints

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228212, 228 447, H01L 21603

Patent

active

054391610

ABSTRACT:
A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.

REFERENCES:
patent: 3628717 (1971-12-01), Lynch et al.
patent: 4573627 (1986-03-01), Miller et al.
patent: 5377897 (1995-01-01), Zimmer

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermocompression bonding apparatus, thermocompression bonding m does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermocompression bonding apparatus, thermocompression bonding m, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermocompression bonding apparatus, thermocompression bonding m will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-966540

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.