Thermocompressing bonding method and thermocompressing bonding a

Details Thermocompressing bonding method and thermocompressing bonding a Thermocompressing bonding method and thermocompressing bonding a

1997-02-27

1998-09-22

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562722, 156325, 1563797, B32B 3100

Patent

active

058109595

ABSTRACT:
A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of the array substrate and a plurality of second conductors formed on the tape carrier package. Subsequently, a heater tool of a thermocompression bonding apparatus applies pressure and heat to the anisotropic conductive adhesive via the tape carrier package. In this case, the anisotropic conductive adhesive is slowly heated up to its hardening end temperature to harden after it softens, thereby thermocompression bonding the first and second conductors to each other by the anisotropic conductive adhesive.

REFERENCES:
patent: 5318651 (1994-06-01), Matsui et al.
patent: 5545281 (1996-08-01), Matsui et al.
patent: 5578527 (1996-11-01), Chang et al.
patent: 5667884 (1997-09-01), Bolger

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