Thermo-siphon and manufacturing method of thermo-siphon and info

Details Thermo-siphon and manufacturing method of thermo-siphon and info Thermo-siphon and manufacturing method of thermo-siphon and info

1998-12-03

2000-08-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361696, 361697, 361717, 622592, 165 805, 16510433, H05K 720, F28D 1500

Patent

active

060975970

ABSTRACT:
The present invention aims to reduce as much as possible the weight of the thermo-siphon being used in spreading heat of the mobile information processing apparatus. The heat spreading board 5 and the thermo-siphon 6 is installed at the lid 51 of the notebook type personal computer, and the heat from the CPU 1 is conducted to the thermo-siphon 6 via the heat pipe 3. The heat spreading board 5 includes the thick part 33 and the thin part 34. The thin part 34 contributes in reducing the weight of the heat spreading board 5.

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