Thermistor chips and methods of making same

Electrical resistors – Resistance value responsive to a condition – Current and/or voltage

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338225D, 338313, 338327, H01C 710

Patent

active

059529113

ABSTRACT:
A thermistor chip is made by first forming first metal layers with a three-layer structure at both end parts of a thermistor element and then forming second metal layers with a three-layer structure on the first metal layers so as to have edge parts that are formed directly in contact with a surface area of the thermistor element and will reduce its normal temperature resistance value. The first and second metal layers are each of a three-layer structure with a lower layer made of a metal with resistance against soldering heat, a middle layer made of a metal with both wettability to solder and resistance against soldering heat, and an upper layer made of a metal having wettability to solder.

REFERENCES:
patent: 3645785 (1972-02-01), Hentzschel
patent: 4831432 (1989-05-01), Hori et al.
patent: 5257003 (1993-10-01), Mahoney
patent: 5294910 (1994-03-01), Tani et al.
patent: 5339068 (1994-08-01), Tsunoda et al.
patent: 5493266 (1996-02-01), Sasaki et al.
patent: 5534843 (1996-07-01), Tsunoda et al.

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