Radiation imagery chemistry: process – composition – or product th – Stripping process or element – Forming nonplanar image
Patent
1985-02-06
1986-11-25
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Stripping process or element
Forming nonplanar image
430260, 430280, 430327, 430330, 430325, 156230, 156240, 522 66, 522 31, 522 15, G03C 1112, G03C 516, B44C 1165
Patent
active
046249125
ABSTRACT:
A process for the production of a protective layer or a relief image on a substrate, wherein a radiation-sensitive layer, consisting of a solid film-forming epoxy resin containing a photoinitiator, which can be activated by radiation, for the polyaddition reaction, is transferred from a support to a substrate, then exposed directly or under a photomask and hardened by the action of heat, after which, if appropriate, the unexposed parts are developed with a solvent. The process is suitable, for example, for the production of printed circuits, solder resist masks and offset printing plates.
REFERENCES:
patent: 3526504 (1970-09-01), Celeste
patent: 4035189 (1977-07-01), Hayashi et al.
patent: 4252592 (1981-02-01), Green
patent: 4299938 (1981-11-01), Green et al.
patent: 4383025 (1983-05-01), Green et al.
patent: 4388137 (1983-06-01), McCarty et al.
patent: 4398014 (1983-08-01), Green et al.
patent: 4438189 (1984-03-01), Geissler et al.
patent: 4465760 (1984-08-01), Leyrer et al.
E. Irving et al., Brit. Polym. J. 15, 24 (1983).
G. E. Green et al., J. Macromol. Sci., C21, 187 (1981).
Chem. Abst. 101, 15033r (1984).
Bauer Sigrid
Meier Kurt
Zweifel Hans
Ciba-Geigy Corporation
Hall Luther A. R.
Hamilton Cynthia
Kittle John E.
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