Thermally stressed heat-conducting structural part or correspond

Details Thermally stressed heat-conducting structural part or correspond Thermally stressed heat-conducting structural part or correspond

1978-02-08

1980-09-30

Davis, Albert W.

Heat exchange

Movable heating or cooling surface

Rotary drum

165 51, 165185, G05D 2300

Patent

active

042249805

ABSTRACT:
A thermally stressed heat-conducting structural part with a temperature gradient that forms during operation, in which at least one layer of metal hydride is embedded in a hydrogen-impervious and heat-conducting manner transversely to the temperature gradient.

REFERENCES:
patent: 3167159 (1965-01-01), Bovenkerk

Affiliated with

Also associated with

Rating

Thermally stressed heat-conducting structural part or correspond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally stressed heat-conducting structural part or correspond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally stressed heat-conducting structural part or correspond will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1164763