Thermally stable hot-melt adhesive composition containing polyca

Chemistry of carbon compounds – Miscellaneous organic carbon compounds – C-metal

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260827, 428447, C08L 4304, C08L 8306, C08L 8310

Patent

active

041170270

ABSTRACT:
An adhesive composition is disclosed comprising a silicon block copolymer and a tackifier. The adhesive is capable of forming an unexpectedly strong bond with substrates having low surface energy without having to etch the surface of the substrate. Furthermore, the adhesive has good thermooxidative and electrical properties which latter properties are unaffected by water.

REFERENCES:
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patent: 3419634 (1968-12-01), Vaughn
patent: 3419635 (1968-12-01), Vaughn
patent: 3644245 (1972-02-01), Flanagan
patent: 3679774 (1972-07-01), LeGrand
patent: 3803079 (1974-04-01), Hokama
patent: 3821325 (1974-06-01), Merritt et al.
patent: 3832419 (1974-08-01), Merritt
Ojima, N., et al. "Hot-Melt Adhesive Composition" Feb. 1964, Japan 74 07,571; C.A. 83 60508t.

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