Boring or penetrating the earth – Bit or bit element – Specific or diverse material
Reexamination Certificate
2005-05-16
2009-02-10
Neuder, William P (Department: 3672)
Boring or penetrating the earth
Bit or bit element
Specific or diverse material
C175S435000, C175S420200, C175S426000
Reexamination Certificate
active
07487849
ABSTRACT:
A cutting element and a method for forming a cutting element is described and shown. The cutting element includes a substrate, a TSP diamond layer, a metal interlayer between the substrate and the diamond layer, and a braze joint securing the diamond layer to the substrate. The thickness of the metal interlayer is determined according to a formula. The formula takes into account the thickness and modulus of elasticity of the metal interlayer and the thickness of the TSP diamond. This prevents the use of a too thin or too thick metal interlayer. A metal interlayer that is too thin is not capable of absorbing enough energy to prevent the TSP diamond from fracturing. A metal interlayer that is too thick may allow the TSP diamond to fracture by reason of bending stress. A coating may be provided between the TSP diamond layer and the metal interlayer. This coating serves as a thermal barrier and to control residual thermal stress.
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Coy Nicole
Jagger Bruce A.
Neuder William P
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