Thermally stable copper-containing polyamide molding compounds

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

524606, C08K 5098

Patent

active

059656522

ABSTRACT:
The invention relates to thermally stable and UV-stable polyamide molding compounds containing colloidal copper formed in situ and to a process for their production.

REFERENCES:
patent: 2705227 (1955-03-01), Stamatoff
patent: 2960489 (1960-11-01), Gabler et al.
patent: 3280052 (1966-10-01), Watanabe et al.
patent: 3308091 (1967-03-01), Zapp
patent: 3384616 (1968-05-01), Heller et al.
patent: 3499867 (1970-03-01), Nakamura et al.
patent: 3691131 (1972-09-01), Kelmchuk
patent: 3814728 (1974-06-01), Bostic et al.
patent: 3947424 (1976-03-01), Tomek
patent: 4745006 (1988-05-01), Mohajer
patent: 4851466 (1989-07-01), Plischke et al.
Hackh's Chemical Dictionary--pp. 222 & 223, 4th edition (1969).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally stable copper-containing polyamide molding compounds does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally stable copper-containing polyamide molding compounds, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally stable copper-containing polyamide molding compounds will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-653396

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.