Thermally stable adhesive comprising soluble polyimide resin and

Details Thermally stable adhesive comprising soluble polyimide resin and Thermally stable adhesive comprising soluble polyimide resin and

1985-09-12

1987-09-08

Pertilla, Theodore E.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252512, 523400, 523443, 523444, 523458, 523461, 525423, 525429, H01B 1021

Patent

active

046922725

ABSTRACT:
A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) an epoxy resin, (d) a cross-linking agent reactive with the polyimide solvent of (b), and (e) a catalyst which accelerates the reaction between (b) and (d). Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.

REFERENCES:
patent: 4401777 (1983-08-01), Tsuboi et al.
patent: 4557860 (1985-12-01), Disalvo et al.

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