Thermally stable adhesive

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252512, 523400, 523443, 523444, 523448, 525112, 525423, H01B 102

Patent

active

046042300

ABSTRACT:
A novel adhesive exhibiting low outgassing upon exposure to high temperature is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) a tackifier, (d) an epoxy resin, (e) a hardener for said epoxy resin, (f) a catalyst which catalyzes the reaction between the epoxy and hardener, (g) a cross-linking agent reactive with the polyimide solvent of (b), (h) a catalyst which accelerates the reaction between (b) and (g), and (i) a filler material. Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.

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R. Dietz, et al., "An Innovation in Materials for Attaching Silicon Devices", 1982, Int. J. Hybrid Microelectronics, 5(2), 480-486.
C. C. Proctor, "Conductive Adhesives", May/Jun. 1982, Paint & Resin, 52(3), 18-21.

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