Thermally reworkable epoxy resins and compositions based...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Details

C427S386000, C438S127000, C525S481000, C525S485000, C525S486000, C525S526000, C525S528000, C549S523000, C549S546000, C560S055000, C560S060000, C560S064000, C560S128000, C560S183000

Reexamination Certificate

active

06916890

ABSTRACT:
The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak α-alkoxy ester linkages providing for the reworkable aspect of the invention.

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