Thermally reworkable binders for flip-chip devices

Details Thermally reworkable binders for flip-chip devices Thermally reworkable binders for flip-chip devices

1996-12-16

1998-06-02

Yoon, Tae

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

524789, 29841, 4289033, 438108, 438118, H01L 2156, H01L 2328

Patent

active

057603375

ABSTRACT:
A semiconductor device is attached to a supporting substrate by a plurality of solder connections that extend from the supporting substrate to the semiconductor device and the gap between the supporting substrate and the semiconductor device is filled with a reworkable composition comprising:

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"A Novel Chip Replacement Method for Encapsulated Flip Chip Bonding," by Y. Tsukada, Y. Mashimoto, N. Watanuki, Proceedings of the 43rd Electronic Components and Technology Conference 1993, IEEE, pp. 199-204.
"Encapsulant for Fatigue Life Enhancement of Controlled Collapse Chip Connection (C4)," by D. W. Wang and K. I. Papathomas, IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(8), Dec. 1993, pp. 780-784.

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