Thermally reactive lead assembly and method for making same

Details Thermally reactive lead assembly and method for making same Thermally reactive lead assembly and method for making same

1991-12-31

1993-05-25

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 361389, 361391, 361400, 165185, 174 163, 174 152, 439 66, 439 91, H05K 720

Patent

active

052145638

ABSTRACT:
Thermally reactive lead assemblies and electronic circuits are provided which include a solderable, conductive metallic element having a first configuration at ambient temperature and a second expanded configuration at an elevated temperature, such as at soldering temperatures. The second configuration of the conductive metallic element provides electrical continuity between a pair of soldering locations of the electronic circuit, such as between a semiconductor device lead and a conductive surface on a printed circuit board.

REFERENCES:
patent: 3842189 (1974-10-01), Southgate
patent: 4673967 (1987-06-01), Hingorany
patent: 4949223 (1990-08-01), Achiwa
patent: 5030109 (1991-07-01), Dery
patent: 5035628 (1991-07-01), Casciotti et al.
patent: 5069627 (1991-12-01), Buck et al.

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