Thermally matched flip-chip detector assembly and method

Details Thermally matched flip-chip detector assembly and method Thermally matched flip-chip detector assembly and method

1994-08-08

1997-09-30

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437217, H01L 2160

Patent

active

056725450

ABSTRACT:
A flip-chip assembly and method for reducing the stress in its metal interconnections resulting from thermal mismatch includes a detector that has a radiation sensitive circuit on a substrate that is flip-chip connected to a layer of semiconductor material that is provided with a readout circuit. The substrate has a thermal coefficient of expansion (TCE) greater than the semiconductor layer such that operating the detector over a predetermined temperature range would stress the flip-chip connections. A first compensation layer on the readout chip has a TCE greater than the substrate's, and a second compensation layer on the first layer has a TCE approximately equal to the semiconductor layer's. The materials and thicknesses of the compensation layers are selected such that the TCE of a composite structure that includes the semiconductor and compensation layers is approximately equal to the substrate's TCE to avoid the stress over the predetermined temperature range. In the preferred embodiment, the composite structure is mounted on a platform, which has a TCE approximately equal to that of the substrate.

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Liu, C. N.,"Matching the Thermal Coefficients of Expansion of Chips to Module Substrate", IBM Technical Disclosure Bulletin, vol. 19, No. 12, May 1977, pp. 4666-4667.

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