Thermally matched electronic components

Details Thermally matched electronic components Thermally matched electronic components

1994-06-29

1996-04-09

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361720, 361722, H05K 720

Patent

active

055067549

ABSTRACT:
Discrete circuit devices constructed on a component substrate thermally matched to the supporting substrate of a higher level circuit assembly. Upon securing each component to the supporting substrate of a higher level circuit assembly, a connection subject to reduced thermal stress is obtained. In the construction of an exemplary surface mount, hybrid component containing resistors and capacitors, a component substrate of a polyimide impregnated material is populated with a repeating matrix of chip capacitors and chip resistors, which are adhesively bound and soldered to selected termination pads containing high temperature solder filled through vias. The substrate is epoxy encapsulated and then diced at selected ones of the through vias into multiple components. Each thermally matched component is resoldered at the separated vias to obtain surface mount terminations. Portions of the vias may be exposed through the component sidewall to permit circuit test. Other, exemplary thermally matched components, constructed of multi-layer resin or ceramic substrates are also disclosed and wherein external termination pads are concentrated to the center of the component. Alternative, thermally matched transmission lines and resistor network circuits are also disclosed.

REFERENCES:
patent: 4689110 (1987-08-01), Leibowitz
patent: 4764846 (1988-08-01), Go
patent: 4774632 (1988-09-01), Neugebauer
patent: 4983533 (1991-01-01), Go
patent: 5222014 (1993-06-01), Lin
patent: 5239198 (1993-08-01), Lin et al.
patent: 5313365 (1994-05-01), Pennisi et al.

Affiliated with

Also associated with

Rating

Thermally matched electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally matched electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally matched electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-143055