Thermally isolating transformer

Details Thermally isolating transformer Thermally isolating transformer

1999-05-05

2001-08-28

Mai, Anh (Department: 2832)

Inductor devices

With temperature modifier

Heat exchanging surfaces

C336S178000, C336S090000, C336S096000, C361S702000

Reexamination Certificate

active

06281776

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a new and improved thermally isolating transformer and to a system for maintaining electronic components at low temperatures which includes such a transformer. More particularly the invention relates to a transformer for the supply of power to refrigerated electronic components wherein a gap in the transformer core or a space between one of the coils and the core is created to reduce heat transfer from the transformer to the electronic components.
2. Description of Related Art
The concept of cooling electronic components is well recognized in the art. The supply of power to such components has resulted in conduction or convection of heat from transformer coils to the components. The present invention differs from prior efforts to reduce such heat transfer by creating a gap which isolates one winding of the transformer (which is, in turn, connected to the electronic components) from the transformer core or the creation of a gap in the transformer core.
SUMMARY OF THE INVENTION
One system for improving electronic component performance by reducing the temperature of such components comprises enclosing the components in a heat insulated package and refrigerating the package. Such package is enclosed in a housing which, in accordance with the present invention, is preferably under vacuum. Performance of a microprocessor can be enhanced significantly by effectively removing heat generated by certain electrical components. In addition, the operating speed of the microprocessor can be greatly increased if the microprocessor is operated at low temperatures. A transformer located in the housing has secondary windings which are connected to the components within the cold package to supply power thereto.
The present invention substantially reduces the amount of heat transferred from the transformer to the interior of the cold package. In one form of the invention, the interior diameter of one coil or winding (preferably the secondary) of the transformer is larger than the portion of the core around which the secondary is wound. A spacer may be positioned around the core and within the coil or there may simply be a gap at such location.
Another means for heat insulating the secondary from the primary of the transformer is to create a gap in the core. In either this form of the invention or that of the preceding paragraph, the gap or space reduces heat transfer from the primary coil or the core.


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