Thermally insulative mounting with solid state device

Details Thermally insulative mounting with solid state device Thermally insulative mounting with solid state device

1984-05-31

1986-06-24

Albritton, Clarence L.

Electrical resistors

Resistance value responsive to a condition

Gas, vapor, or moisture absorbing or collecting

73 23, 73 27R, 361317, H01L 700

Patent

active

045969752

ABSTRACT:
A mounting for integrated circuit chips or solid state gas sensors, with superior thermal and electrical insulative properties. The mounting incorporates a tiny thin-wall glass capillary tube as the pedestal on which the chip or sensor is mounted. The glass tube holding the chip or sensor is then mounted on any base. A high temperature ceramic adhesive is used to hold the structure together. This method gives good mechanical support to the chip or sensor while reducing the amount of heat lost to the support structure. By using this technique, the amount of power required to heat the device to elevated temperature is vastly reduced.

REFERENCES:
patent: 3654579 (1972-04-01), Kurtz et al.
patent: 3732519 (1973-05-01), Taguchi
patent: 3873956 (1975-03-01), Kurtz et al.
patent: 4030340 (1977-06-01), Chang
patent: 4197089 (1980-04-01), Willis et al.
patent: 4216404 (1980-08-01), Kurtz et al.
patent: 4412203 (1983-10-01), Kurtz et al.

Affiliated with

Also associated with

Rating

Thermally insulative mounting with solid state device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally insulative mounting with solid state device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally insulative mounting with solid state device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2086716