Thermally insulative and electrically conductive interconnect an

Radiant energy – Infrared-to-visible imaging – Including detector array

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156633, 156643, 156651, 156656, 1566591, 156668, 156902, 250338, 250349, 437 3, 437180, H01L 2500, G01J 100, B44C 122, B29C 3700

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047407000

ABSTRACT:
A pyroelectric focal plane array useful for thermal imaging applications comprises a detector (10), comprises a reticulated and aluminized pyroelectric chip (12) interfaced with a signal processor chip (14) by thermally insulating bumps (30) coated with a thin conductive layer (38) to form a plurality of thermally insulative and electronically conductive interconnections (16) between detector chips (12) and processor chip (14).

REFERENCES:
patent: 4072863 (1978-02-01), Roundy
patent: 4290844 (1981-09-01), Rotolante et al.
patent: 4354109 (1982-10-01), White et al.
patent: 4400868 (1983-08-01), Antypas et al.
patent: 4416054 (1983-11-01), Thomas et al.
patent: 4532424 (1985-07-01), Cheung
patent: 4616403 (1986-10-01), Schulte et al.

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