Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Rod – strand – filament or fiber
Patent
1996-09-10
1999-08-03
Mosley, Terressa
Stock material or miscellaneous articles
Coated or structually defined flake, particle, cell, strand,...
Rod, strand, filament or fiber
428209, 428357, 428384, 4284735, D02G 300
Patent
active
059323450
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to novel copolymer having thermal fusible adhesive property, powder particles comprising thermoplastic polyimide resin mainly comprising said thermal fusible adhesive copolymer, flexible copper-coated laminate sheets, laminated films such as laminated films for insulative covering or thermal fusible adhesive films for wire covering, those films used for cover-films, cover-lay films, bonding sheets, cover coat ink, lead-on chips, or lead-frame fixing tapes, laminated insulation material, electronic modules, capacitors, and methods of producing said objects.
BACKGROUND ART
Recently, provision of higher operating performance, higher operating function, and further down-sizing has rapidly been promoted for electronic apparatuses, and accordingly, there is a greater demand for further down-sizing and lighter weight of electronic parts used for electronic apparatuses. Likewise, there is a strong demand for higher thermal resistance, higher mechanical strength, and higher electric characteristics of materials used for composing electronic parts. In addition, higher density, higher operating function and higher operating performance characteristics are demanded for the method of packaging semiconductor elements as well as for printed circuit boards for mounting them.
For example, against conventional hard printed circuit boards for loading electronic parts, flexible printed circuit boards have drawn attention of the concerned to result in the sharp increase of the demand for them. In the field of packaged semiconductor modules, for example, a variety of structures such as COL (chip on lead) for loading a chip on a lead frame devoid of die-pad or LOC (lead on chip) for loading lead wires on a chip have been proposed relative to materialization of higher functional capability and greater capacity, and these devices have actually been offered for practical service. To satisfy such requirements, wire-thinning and formation of multi-layers have been executed for flexible printed circuit boards (FPC) to result in the debut of such FPCs for mounting electronic parts, or bilateral FPCs, or such extremely dense multi-layer FPCs. This in turn results in the demand for higher performance capability of insulation adhesive agent and insulation organic film. In particular, in the case of high-density-loading materials such as Loc packages or MCMs (multi-chip module) or print-wiring material such as multi-layer FPCs or in the case of using them for composing space-aviation material, it is essential that usable materials contain extremely high thermal resistant property and mechanical strength and be capable of exerting distinguished workability and adhesive property, particularly it is required that usable materials be extremely low in moisture absorbent property, and yet, be combined with essential characteristics such as dielectric property and dimensional stability.
For the present, such films composed of polyimide resin having high thermal resistant property and mechanical strength and outstanding electric characteristic have preferentially been used as organic insulating material for making up base film or cover film of FPCs. However, normally, polyimide resin itself is substantially insoluble and infusible in the closed cycle condition. Since polyimide resin is thermally infusible, it is devoid of adhesive property. Accordingly, adhesive agent is used for adhesion and covering purpose. In many cases, because of satisfactory processable property under low temperature range (below 180.degree. C.) and workability, epoxy resin and acrylic resin are respectively used for insulating adhesive agent. On the other hand, generally, epoxy adhesive agent is mainly used for adhering a cover-lay film onto circuit surface of a flexible printed circuit board. However, it is essential that a perforation process be executed against the cover-lay film before adhering the film onto the flexible printed circuit board. Conventionally, positioning of the cover-lay film against the flexible
REFERENCES:
patent: 4087862 (1978-05-01), Tsein
patent: 4292259 (1981-09-01), Roth et al.
patent: 4389312 (1983-06-01), Beard
Furutani Hiroyuki
Hase Naoki
Ida Junya
Inoue Shinji
Nagano Hirosaku
Kanegafuchi Kagaku Kogyo & Kabushiki Kaisha
Mosley Terressa
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