Thermally expanding base of heatsink to receive fins

Details Thermally expanding base of heatsink to receive fins Thermally expanding base of heatsink to receive fins

2007-10-23

2007-10-23

Prasad, Chandrika (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300

Reexamination Certificate

active

11107187

ABSTRACT:
Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base.

REFERENCES:
patent: 3579805 (1971-05-01), Kast
patent: 3948533 (1976-04-01), Novosad
patent: 5014776 (1991-05-01), Hess
patent: 5254025 (1993-10-01), Spaulding et al.
patent: 5771966 (1998-06-01), Jacoby
patent: 5985697 (1999-11-01), Chaney et al.
patent: 6034430 (2000-03-01), Hamburgen
patent: 6633484 (2003-10-01), Lee et al.
patent: 6742581 (2004-06-01), Mochizuki et al.
patent: 6758262 (2004-07-01), Kawabata et al.
patent: 7108055 (2006-09-01), Krassowski et al.
patent: 2002/0041959 (2002-04-01), Kawai
patent: 2002/0070005 (2002-06-01), Kawabata et al.
patent: 2002/0166654 (2002-11-01), Smaic
patent: 2003/0178190 (2003-09-01), Ellsworth
patent: 2003/0183379 (2003-10-01), Krassowski et al.
patent: 2003/0221816 (2003-12-01), Ellsworth
patent: 2004/0134646 (2004-07-01), Chu
patent: 2004/0264134 (2004-12-01), Cheng
patent: 2005/0000682 (2005-01-01), Chien et al.
patent: 2005/0211416 (2005-09-01), Kawabata et al.
Julian Norley, The Development of a Natural Graphite Heat-Spreader, Graftech Inc., 2001 IEEE.
Julian Norley, High Performance, Lightweight Graphite Heat Sinks/Spreaders, Graftech Inc., PCIM 2002, Nurnberg, Germany, May 14-16, 2002, 2002 IEEE.
E.E. Marotta, Thermal Performance of a Silicon-Die/Water-Cooled Heatsink Assembly: Experimental Investigation, 41st Aerospace Sciences Meeting and Exhibit, Jan. 6-9, 2003.

Affiliated with

Also associated with

Rating

Thermally expanding base of heatsink to receive fins does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally expanding base of heatsink to receive fins, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally expanding base of heatsink to receive fins will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3838183