Thermally enhanced test socket

Details Thermally enhanced test socket Thermally enhanced test socket

1997-12-30

2000-06-06

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, G01R 3102

Patent

active

06072322&

ABSTRACT:
A test socket having a heat slug for removing heat from an electronic device positioned within the socket. In one embodiment the test socket includes a burn-in board electrically coupled to a test unit that generates a series of test signals to test the performance of the electronic device. Examples of electronic devices that can be tested by the test socket are integrated circuit packages such as tape carrier packages (TCP), ball grid arrays (BGA), pin grid arrays (PGA), land grid arrays (LGA), and other packages. The integrated circuit package is positioned within the socket which electrically connects the package to a printed circuit board, such as a burn-in board. The test socket includes an opening in which a heat slug is disposed. The heat slug has a contact surface that contacts the integrated circuit device under test. In another embodiment, the socket includes a lid having a heat slug attached to the lid, which heat slug has a contact surface that contacts an integrated circuit device under test.

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