Thermally enhanced semiconductor package with EMI shielding

Details Thermally enhanced semiconductor package with EMI shielding Thermally enhanced semiconductor package with EMI shielding

2005-03-08

2005-03-08

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S709000, C361S818000, C257S706000, C257S712000, C257S713000, C257S787000, C257S796000, C174S034000, C165S080200, C165S080300

Reexamination Certificate

active

06865084

ABSTRACT:
A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate, and a thermally conductive member is stacked on the chip and electrically coupled to the surface of the substrate by bonding wires. An encapsulant is formed and encapsulates the chip, thermally conductive member, and bonding wires. A plurality of solder balls are implanted on an opposite surface of the substrate. The thermally conductive member is grounded via the bonding wires, substrate, and solder balls, and provides an EMI shielding effect for the chip to protect the chip against external electric and magnetic interference. The thermally conductive member has a coefficient of thermal expansion similar to that of the chip, and reduces thermal stress exerted on the chip and enhances mechanical strength of the chip to thereby prevent chip cracks.

REFERENCES:
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 5339216 (1994-08-01), Lin et al.
patent: 5866943 (1999-02-01), Mertol
patent: 5997626 (1999-12-01), Wu et al.
patent: 6229702 (2001-05-01), Tao et al.
patent: 6313528 (2001-11-01), Solberg
patent: 6472598 (2002-10-01), Glenn
patent: 6580167 (2003-06-01), Glenn et al.
patent: 6667546 (2003-12-01), Huang et al.

Affiliated with

Also associated with

Rating

Thermally enhanced semiconductor package with EMI shielding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally enhanced semiconductor package with EMI shielding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally enhanced semiconductor package with EMI shielding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3408541