Patent
1990-09-28
1992-04-14
James, Andrew J.
357 81, 357 70, 357 80, H01L 2328
Patent
active
051052598
ABSTRACT:
A semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to a semiconductor die mounted surface. In one form, a semiconductor die is attached to a mounting surface of a leadframe. The leadframe also has a plurality of leads which are electrically coupled to the semiconductor die. The semiconductor die and portions of the leads encapsulated in a package body. Also incorporated in the package body is a heat sink. The heat sink has an opening which extends through the heat sink and exposes a portion of the mounting surface of the leadframe. The opening is used to apply a vacuum to the mounting surface during the formation of the package body so that the mounting surface and heat sink are held in close proximity. The closeness provides a good thermal conduction path from the semiconductor die to the ambient, thereby enhancing the thermal dissipation properties of the device.
REFERENCES:
patent: 4866506 (1989-09-01), Nambu et al.
patent: 4910581 (1990-03-01), Baird
M. McShane et al., "A Unique Low Cost Pin Grid Array Package With Heat-Spreader", Proceedings of the Ninth Annual International Electronics Packaging Conference, Sep. 11-13, 1989, pp. 199-207.
Casto James J.
Joiner Bennett A.
McShane Michael B.
Davenport T.
Goddard Patricia S.
James Andrew J.
Motorola Inc.
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