Thermally enhanced piezoelectric composite system and method

Details Thermally enhanced piezoelectric composite system and method Thermally enhanced piezoelectric composite system and method

2006-07-20

2008-05-27

Dougherty, Thomas M. (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S322000, C029S025350

Reexamination Certificate

active

07378779

ABSTRACT:
A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.

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patent: WO2004114425 (2004-12-01), None

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