Thermally enhanced packaging structure and fabrication...

Details Thermally enhanced packaging structure and fabrication... Thermally enhanced packaging structure and fabrication...

2006-01-24

2006-01-24

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S777000, C257S779000

Reexamination Certificate

active

06989293

ABSTRACT:
A thermally enhanced packaging structure and fabrication method thereof. The structure includes a printed circuit board (PCB), heat-conductive substrate laminated with the PCB, first chip on the heat-conductive substrate, conductor electrically connecting the chip and PCB, and isolation structure isolating the chip and conductor from the external environment.

REFERENCES:
patent: 5541450 (1996-07-01), Jones et al.
patent: 5708567 (1998-01-01), Shim et al.
patent: 6005289 (1999-12-01), Watanabe et al.
patent: 6720651 (2004-04-01), Gaku et al.

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