Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-06-07
1997-07-22
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257710, 361705, H05K 720
Patent
active
056509154
ABSTRACT:
The present invention provides a thermally enhanced molded cavity package (10) having a package body (12) with upper (40) and lower (42) sections. The package body (12) has a cavity (22) with the cavity opening (32) in the upper section (40) of the package body (12). The present package (10) includes a lead frame (14) with a plurality of individual leads (16) that are external to the cavity (22) and a plurality of lead fingers (28) that are internal to the cavity (22). The present package (10) also includes a heat spreader (34) for increasing heat dissipation from the package (10) in the lower section (42) of the package body (12) and coupled to the lead frame (14). The heat spreader (34) has a first surface (26) forming a floor of the cavity upon which a microcircuit chip (24) may be mounted and a second surface forming a base (36) of the package body (12). The upper section (40) of the package body (12) includes a lid seat (33) for supporting a lid (30) and for maintaining the lid (30) parallel to the floor (26) of the cavity when the lid (30) is placed in the cavity opening (32).
REFERENCES:
patent: 4099200 (1978-07-01), Koutalides
patent: 4890152 (1989-12-01), Hirata
patent: 5261157 (1993-11-01), Chang
patent: 5264393 (1993-11-01), Tamara
patent: 5293301 (1994-03-01), Tanaka
patent: 5379187 (1995-01-01), Lee
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patent: 5471011 (1995-11-01), Maslakow
Alfaro Rafael Cesar
Heinen Katherine Gail
Hundt Paul Joseph
Braden Stanton C.
Brady III W. James
Donaldson Richard L.
Texas Instruments Incorporated
Tolin Gerald P.
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