Thermally enhanced memory module

Details Thermally enhanced memory module Thermally enhanced memory module

2007-06-04

2009-10-20

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C361S720000, C257S712000, C165S080300

Reexamination Certificate

active

07606034

ABSTRACT:
A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.

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International Search Report and Written Opinion issued to applicant Corsair Memory on Feb. 12, 2008 in PCT Application PCT/US07/70446.

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