Thermally enhanced lid for multichip modules

Details Thermally enhanced lid for multichip modules Thermally enhanced lid for multichip modules

2007-03-06

2007-03-06

Le, Thao X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S125000, C257S704000

Reexamination Certificate

active

10665669

ABSTRACT:
An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.

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