Thermally enhanced leadframe for packages that utilize a large n

Details Thermally enhanced leadframe for packages that utilize a large n Thermally enhanced leadframe for packages that utilize a large n

1995-05-19

1996-07-02

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257675, 361813, H05K 720

Patent

active

055329055

ABSTRACT:
A leadframe that exhibits improved thermal dissipation and that can be incorporated into standard integrated circuit (IC) packages is provided by increasing the thermal cross-section between the leadframe paddle and the lead fingers (leads) so that the leads are utilized for conducting a significant amount of heat away from the IC. A larger thermal cross-section can be achieved by making the shape of the paddle perimeter nonlinear to increase the surface area of its edge. In the preferred embodiment, the paddle perimeter has a "serpentine" shape and the inner ends of the leads are placed in close proximity to the paddle perimeter and are shaped to substantially follow its serpentine shape. The shaped paddle and lead ends increase the thermal cross-section between the paddle and the leads, resulting in improved thermal conduction. The leads conduct the heat to the outside of the package, where it is dissipated into the circuit board on which the leadframe package is mounted. For a package with a large number of leads, the paddle perimeter preferably has a saw-tooth shape, with at least some of the leads positioned between adjacent teeth.

REFERENCES:
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 4809053 (1989-02-01), Kuraishi
patent: 5057805 (1991-10-01), Kadowaki
patent: 5146310 (1992-09-01), Bayan et al.
patent: 5332864 (1994-07-01), Liang et al.
patent: 5334872 (1994-08-01), Ueda et al.
patent: 5440170 (1995-08-01), Tsuji et al.

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