Thermally enhanced heat sink BGA package

Details Thermally enhanced heat sink BGA package Thermally enhanced heat sink BGA package

2005-12-13

2005-12-13

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S713000, C257S784000, C257S796000, C165S080200, C165S185000, C165SDIG119, C361S708000, C361S710000, C361S718000, C361S722000

Reexamination Certificate

active

06975512

ABSTRACT:
Provided are heat sink BGA packages with thermally enhanced mold compounds to further facilitate heat transfer from the die out of the package. Packages in accordance with the present invention incorporate mold compounds with ceramic fillers. The ceramic filled mold compound facilitates the heat transfer between the encapsulated die and the heat sink, thereby enhancing the thermal performance of the package.

REFERENCES:
patent: 5172213 (1992-12-01), Zimmerman
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5909056 (1999-06-01), Mertol
patent: 6621152 (2003-09-01), Choi et al.

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