Thermally enhanced foam insulation

Details Thermally enhanced foam insulation Thermally enhanced foam insulation

1996-03-19

1997-06-10

Cannon, James C.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

2 216, 2 5, 206523, 206524, 2065246, 220 15, 220902, 264 453, 264 465, 297DIG1, 426109, 426127, 428 71, 428 95, 4283179, 4283202, B32B 102, B32B 106, B32B 516, B32B 518

Patent

active

056373899

ABSTRACT:
A thermal barrier in the form of a base material with a plurality of microcapsules containing a phase change material forms an insulative pad, such as a shoe insole. The microcapsules are surroundingly encapsulated and embedded within the base material. In addition, substantially all of the microcapsules are spaced apart from each other, the space between neighboring adjacent microcapsules containing a phase change material. The microcapsules may be anisotropically distributed to further reduce thermal conductivity of heat through the thermal barrier.

REFERENCES:
patent: 4756958 (1988-07-01), Bryant et al.
patent: 5366801 (1994-11-01), Bryant et al.
patent: 5499460 (1996-03-01), Bryant et al.

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