Thermally enhanced flip chip package and method of forming

Details Thermally enhanced flip chip package and method of forming Thermally enhanced flip chip package and method of forming

2006-12-12

2006-12-12

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S127000

Reissue Patent

active

RE039426

ABSTRACT:
A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.

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