Thermally enhanced flip chip package and method of forming

Details Thermally enhanced flip chip package and method of forming Thermally enhanced flip chip package and method of forming

1996-09-17

1998-03-10

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438108, 438127, H01L 2144

Patent

active

057260796

ABSTRACT:
A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.

REFERENCES:
patent: 5289346 (1994-02-01), Carey et al.
patent: 5359768 (1994-11-01), Haley
patent: 5405809 (1995-04-01), Nakamura et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5471027 (1995-11-01), Call et al.
patent: 5490324 (1996-02-01), Newman

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